Yield Threats and Inadequacy of One-time Test
نویسنده
چکیده
In addition to traditional manufacturing test, today’s yield optimization procedures for very deep submicron chips necessitate the use of test technology. These procedures are meant to ensure the manufacturability of the chips and to achieve adequate levels of yield and reliability. This position statement summarizes the key trends and challenges resulting in manufacturing susceptibility and field reliability that necessitate the use of such procedures. It also lists several examples of such yield optimization procedures throughout the chip realization flow.
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